납땜 / BGA

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is_customized : Yes

Voltage : AC 220V

Rated Capacity : 1000W

Usage : reflow station

Dimensions : 45x33x34cm

Weight : 15KG

Features:

1. Adopt infrared weld technology which independent exploration.

2. Use infrared heat, easy to cut through, heat proportion piercing

tradition weld machine with sirocco.

3. Easily operate. Just need one day training. Can operation this

machine.

4. Don't need weld tools. This machine can weld all the component

of 35x35-50x50mm.

5. This machine has 800W heating system. Widely to 240x180mm.

6. Infrared heating don't have sirocco flow. Don't impact perimeter

small component. Can suitable for the entire component, especially

Micro BGA component.

7. Definitely can satisfy the computer, the notebook, the electricity

swims and so on the BGA sealing off/repairs to request; Specially

especially suits to the computer north and south bridge.

Technical parameter

Work floor size: 360X240mm

Rated voltage and frequency: AC220

Complete machine power: 1000W

Infra-red lamp body power: 150W

Preheating chassis power: 800W

Infra-red lamp body heating size: Φ70mm(50x50mm)

Preheating chassis preheating size: 240x180mm

Infra-red lamp body temperature adjustable: 200°C-350°C

Preheating chassis temperature adjustable: 60°C-200°C

소형 BGA IR장비 입니다.

소형제품으로 자리 차지를 많이 하지 않습니다.

그래픽카드 / 모바일 / 하드기판 / 스마트폰등 소형 기판 작업하기 좋습니다.

상부히터 + 하부히터 조합으로 우수한 품질의 BGA작업을 수행합니다.

상/하 온도센서로 보다 정확한 BGA작업이 가능합니다.

사무실 내방후 제품성능을 확인하세요.

방문 수령 가능한 제품입니다.